High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling
High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling

High Density Fin Aluminum Heat Sink Profile 6063-T5 for Electronic & Power Cooling

$1800-2600
FOB
Size:
L(100)*W(100)*H(100) cm
MOQ:
1
Shipping:
Express Delivery, Air freight, Land freight, Ocean freight
Sample:Free supportGet samples
Specification:
Product details
Attachments
FAQ
Essential details
Volume:1 m³
MOQ:1
G.W:3000 kg
Lead time:Negotiable
Size:L(100)*W(100)*H(100) cm
Shipping:Express Delivery, Air freight, Land freight, Ocean freight
Specification Number:AL-PRO-HEATSINK-006
Product Introduction

High Density Fin Aluminum Heat Sink Profile – Electronic Cooling Grade

Product Overview

High density fin aluminum heat sink profile is a specialized thermal extrusion designed for electronic and power cooling applications. Manufactured from high thermal conductivity 6063 aluminum with precision high-density fin geometry, it delivers maximum heat dissipation surface area and efficient thermal performance. This thermal grade is optimized for power electronics, LED lighting and inverter cooling, providing reliable thermal management for sensitive electronic components.

Why Choose CNB Heat Sink Profiles?

Our heat sink profiles are manufactured on precision high-fin extrusion lines with strict control over fin uniformity, wall thickness and dimensional accuracy. Every profile undergoes thermal performance verification to ensure consistent cooling efficiency. We offer both standard heat sink sizes and custom design development, with value-added machining and surface treatment services to deliver ready-to-install thermal solutions.

Key Specifications

ItemSpecification
Product NameHigh Density Fin Aluminum Heat Sink Profile
Alloy Grade6063-T5 / 6061-T6 thermal grade
Surface TreatmentMill finish, silver / black anodized
Fin TypeStraight fin, pin fin, fork fin
Fin DensityUp to 18 fins / 100mm width
Fin Thickness0.8mm – 3.0mm
Section Width Range30mm – 300mm
Thermal Conductivity≥201 W/m·K (6063-T5)
Applicable StandardsElectronic thermal management standards
Secondary MachiningDrilling, tapping, cutting available

Core Advantages

  • High fin density: Maximum heat dissipation surface area for efficient cooling.
  • Excellent thermal performance: High conductivity aluminum for fast heat transfer.
  • Custom design: Optimized geometry for specific thermal requirements.
  • Precision fins: Uniform fin thickness and spacing for consistent airflow.
  • Ready to install: Machined and finished options for direct assembly.

Applications

This high density fin heat sink profile is widely used for power electronics cooling, LED lighting thermal management, inverter heat sinks, motor drive cooling, server components and general electronic thermal management.

Get a Quotation

We supply standard and custom aluminum heat sink profiles with various fin densities, sizes and surface finishes. Thermal design support and prototype development are available upon request. Contact our thermal aluminum team for a detailed quotation.

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